s d l 1 1 0 8 - r 4 7 m f (a) (c) (b) (e) (d) 1. part no. expression : (b) dimension code (c) inductance code : r47 = 0.47uh (a) series code 2. configuration & dimensions : 4. materials : superworld electronics (s) pte ltd (a) core : ferrite core 3. schematic : (d) tolerance code : m = 20% (e) f : lead free sdl1108 series high current power inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 05.05.2008 (b) wire : enamelled copper wire mm 8.5 max. 8.5 max. 8.5 max. 8.5 max. 12.0 max. 12.0 max. 12.5 max. 12.0 max. sdl1108-2r0mf sdl1108-1r5mf sdl1108-1r2mf sdl1108-1r0mf 12.0 max. 12.0 max. 12.0 max. 12.0 max. 6.40.5 6.20.5 6.20.5 6.20.5 3.40.5 3.40.5 3.40.5 3.40.5 6.50.5 7.20.5 6.60.5 6.60.5 6.60.5 6.60.5 7.20.5 6.50.5 6.40.5 6.20.5 6.20.5 6.20.5 f c mm 8.5 max. 8.5 max. b 12.0 max. 12.0 max. sdl1108-r60mf part no. sdl1108-r47mf e b 12.0 max. 12.0 max. a mm c mm d r47 a i h g 6.70.5 6.70.5 d 3.40.5 3.40.5 mm e 5.60.5 5.60.5 mm 5.60.5 5.60.5 g f mm h 6.70.5 6.70.5 mm pcb pattern +0.2 -0 +0.2 -0 +0.2 1.2 1.4 -0 +0.2 -0 +0.2 1.5 1.5 i -0 +0.2 -0 1.8 1.8 mm a b
superworld electronics (s) pte ltd 6. electrical characteristics : 5. general specification : d) irms (a) : will cause the coil temperature rise approximately ? t=40c without core loss c) ambient temp. : 20c b) storage temp. : -55c to +125c a) operating temp. : -55c to +125c high current power inductors sdl1108 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 05.05.2008 f) part temperature (ambient + temp. rise) : should not exceed 125c under worst case operating conditions e) isat (a) : will cause l to drop approximately 20% typical max. max. 8% ( hz ) 3.5 2.4 2.0 1.7 0.8 0.8 sdl1108-2r0mf sdl1108-1r5mf sdl1108-1r2mf sdl1108-1r0mf sdl1108-r60mf sdl1108-r47mf 1.5020% 2.0020% 1.2020% 1.0020% 0.6020% 0.4720% 0.25v / 100k 0.25v / 100k 0.25v / 100k 0.25v / 100k 0.25v / 100k 0.25v / 100k 30 25 20 25 27 30 38 40 34 40 45 50 dcr ( m
) part no. inductance l ( h ) frequency test ( a ) irms ( a ) isat 0 0
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 05.05.2008 high current power inductors sdl1108 series 7. characteristics curves : sw dl1108-r47mf sdl1108-r47mf sw dl1108-r60mf sdl1108-r60mf swdl1108-1r0mf sdl1108-1r0mf sw dl1108-1r2mf sdl1108-1r2mf swdl1108-1r5mf sdl1108-1r5mf swdl1108-2r0mf sdl1108-2r0mf
superworld electronics (s) pte ltd high current power inductors sdl1108 series note : specifications subject to change without notice. please check our website for latest information. pg. 4 05.05.2008 8. reliability and test condition : solder temperature : 2605c high temperature low temperature humidity resistance life test thermal shock reliability test life test 1. appearance : no damage temperature : 405c measure at room temperature after placing for 2 to 3 hrs. humidity : 90% to 95% applied current : rated curent time : 50012 hours 2. inductance : within 20% of initial value. no disconnection or short circuit. flux for lead free : rosin 260c 150c step 3 2 4 1 measure at room temperature after placing for 2 to 3 hrs. measure at room temperature after placing for 2 to 3 hrs. temperature : 1255c time : 50012 hours time : 50012 hours temperature : -405c conditions of 1 cycle. dip time : 100.5sec. measure at room temperature after placing for 2 to 3 hrs. total : 5 cycles 1. appearance : no damage 2. inductance : within 20% of initial value. no disconnection or short circuit. 2. inductance : within 20% of initial value. times (min.) 303 within 3 within 3 303 room temperature 1253 room temperature temperature (c) -553 100.5 seconds 60 seconds dipping preheating natural cooling mechanical performance test saturation current (isat) solder heat resistance heat rated current (irms) electrical characteristics test solderability test inductance dcr item lcr meter. 230c 150c after fluxing components shall be dipped in a melted isat(a) will cause lo to drop approximately 20%. irms(a) will cause the coil temperature rise solder : sn-ag3.0-cu0.5 preheat : 150c, 60sec. solder bath at 2305c for 4 seconds. approximately ? t=40c without core loss hp4284a, ch11025, ch3302, ch1320, ch1320s ch16502, agilent33420a micro-ohm meter. more than 90% of the terminal electrode should be covered with solder. 1. components should have no evidence of electrical & mechanical damage. performance refer to standard electrical characteristics list 41 seconds 60 seconds dipping preheating natural cooling test condition
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 05.05.2008 high current power inductors sdl1108 series 9. solderind and mounting : products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that e) use a 20 watt soldering iron with tip diameter of 1.0mm styrofoam inner box carton size 2100 420 sdl1108 210 10. packing and quantity : 9-2.2 soldering iron (figure 2) : b) 280c tip temperature (max) natural cooling 30~60s figure 1. re-flow soldering a soldering iron must be employed the following precautions are recommended. a) preheat circuit and products to 150c. c) never contact the ceramic with the iron tip temperature c 150 180 60~120s preheating 250~260 230 soldering 10s max. note : 260 temperature c over 1min. within 3secs. figure 2. iron soldering 150 gradual cooling preheating d) 1.0mm tip diameter (max) f) limit soldering time to 3 secs. 280 soldering natural cooling mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for all wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred techni que is the utilization of hot sdl1108-r47mf part no. sdl1108-r60mf sdl1108-1r0mf sdl1108-1r2mf sdl1108-1r5mf sdl1108-2r0mf recommended temperature profiles for re-flow soldering in figure 1. g i 9-2. soldering air soldering tools. 9-2.1 solder re-flow : h 1.5 +0.2 6.60.5 6.20.5 6.20.5 6.40.5 6.50.5 7.20.5 +0.2 +0.2 1.4 1.2 -0 -0 6.70.5 6.70.5 6.20.5 5.60.5 6.60.5 mm g 5.60.5 h mm +0.2 +0.2 +0.2 1.8 -0 1.5 -0 -0 mm 1.8 i -0
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